Text this: Transient liquid phase Ag-based solder technology for high-temperature packaging applications

導出完成 —  

  ______   _    _     _  __   __   __   _    _   
 /_   _// | || | ||  | |/ //  \ \\/ // | || | || 
 `-| |,-  | || | ||  | ' //    \ ` //  | || | || 
   | ||   | \\_/ ||  | . \\     | ||   | \\_/ || 
   |_||    \____//   |_|\_\\    |_||    \____//  
   `-`'     `---`    `-` --`    `-`'     `---`