發送短信 : Transient liquid phase Ag-based solder technology for high-temperature packaging applications

  ______   _    _    ______     _____    _    _   
 /_   _// | || | || |      \\  |  ___|| | || | || 
   | ||   | || | || |  --  //  | ||__   | || | || 
  _| ||   | \\_/ || |  --  \\  | ||__   | \\_/ || 
 /__//     \____//  |______//  |_____||  \____//  
 `--`       `---`   `------`   `-----`    `---`