APA استشهاد

Agarwala, S., Lee, J. M., Yeong, W. Y., Layani, M., Magdassi, S., & Engineering, S. o. M. a. A. (2019). 3D printed bioelectronic platform with embedded electronics.

استشهاد بنمط شيكاغو

Agarwala, Shweta, Jia Min Lee, Wai Yee Yeong, Michael Layani, Shlomo Magdassi, و School of Mechanical and Aerospace Engineering. 3D Printed Bioelectronic Platform With Embedded Electronics. 2019.

MLA استشهاد

Agarwala, Shweta, et al. 3D Printed Bioelectronic Platform With Embedded Electronics. 2019.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.