APA引文

Agarwala, S., Lee, J. M., Yeong, W. Y., Layani, M., Magdassi, S., & Engineering, S. o. M. a. A. (2019). 3D printed bioelectronic platform with embedded electronics.

Chicago Style Citation

Agarwala, Shweta, Jia Min Lee, Wai Yee Yeong, Michael Layani, Shlomo Magdassi, and School of Mechanical and Aerospace Engineering. 3D Printed Bioelectronic Platform With Embedded Electronics. 2019.

MLA引文

Agarwala, Shweta, et al. 3D Printed Bioelectronic Platform With Embedded Electronics. 2019.