أرسل هذا في رسالة قصيرة: Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation

  ______    ______             __   __    ______  
 /_   _//  /_   _//     ___    \ \\/ //  /_   _// 
 `-| |,-    -| ||-     /   ||   \ ` //   `-| |,-  
   | ||     _| ||_    | [] ||    | ||      | ||   
   |_||    /_____//    \__ ||    |_||      |_||   
   `-`'    `-----`      -|_||    `-`'      `-`'   
                         `-`