APA استشهاد

Lin, P., Babicheva, R. I., Xue, M., Zhang, H. S., Xu, H., Liu, B., . . . Engineering, S. o. M. a. A. (2015). Effects of temperature and voids on the interfacial fracture of Si/a-Si3 N4 bilayer systems.

استشهاد بنمط شيكاغو

Lin, Pamela, Rita I. Babicheva, Ming Xue, Hai Shu Zhang, Huan Xu, Bo Liu, Kun Zhou, و School of Mechanical and Aerospace Engineering. Effects of Temperature and Voids On the Interfacial Fracture of Si/a-Si3 N4 Bilayer Systems. 2015.

MLA استشهاد

Lin, Pamela, et al. Effects of Temperature and Voids On the Interfacial Fracture of Si/a-Si3 N4 Bilayer Systems. 2015.

تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.