Tan, C. S., Razzaq, A., Wee, K. H., Li, K. H., Yu, H., Chua, S. L., & Engineering, S. o. E. a. E. (2014). TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal.

Tan, Chuan Seng, A. Razzaq, K. H. Wee, K. H. Li, H. Yu, S. L. Chua, و School of Electrical and Electronic Engineering. TSV-less 3D Stacking of MEMS and CMOS Via Low Temperature Al-Au Direct Bonding With Simultaneous Formation of Hermetic Seal. 2014.

Tan, Chuan Seng, et al. TSV-less 3D Stacking of MEMS and CMOS Via Low Temperature Al-Au Direct Bonding With Simultaneous Formation of Hermetic Seal. 2014.