Tan, C. S., Razzaq, A., Wee, K. H., Li, K. H., Yu, H., Chua, S. L., & Engineering, S. o. E. a. E. (2014). TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal.

Tan, Chuan Seng, A. Razzaq, K. H. Wee, K. H. Li, H. Yu, S. L. Chua, and School of Electrical and Electronic Engineering. TSV-less 3D Stacking of MEMS and CMOS Via Low Temperature Al-Au Direct Bonding With Simultaneous Formation of Hermetic Seal. 2014.

Tan, Chuan Seng, et al. TSV-less 3D Stacking of MEMS and CMOS Via Low Temperature Al-Au Direct Bonding With Simultaneous Formation of Hermetic Seal. 2014.