APA引文

Tan, C. S., Razzaq, A., Wee, K. H., Li, K. H., Yu, H., Chua, S. L., & Engineering, S. o. E. a. E. (2014). TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal.

Chicago Style Citation

Tan, Chuan Seng, A. Razzaq, K. H. Wee, K. H. Li, H. Yu, S. L. Chua, and School of Electrical and Electronic Engineering. TSV-less 3D Stacking of MEMS and CMOS Via Low Temperature Al-Au Direct Bonding With Simultaneous Formation of Hermetic Seal. 2014.

MLA引文

Tan, Chuan Seng, et al. TSV-less 3D Stacking of MEMS and CMOS Via Low Temperature Al-Au Direct Bonding With Simultaneous Formation of Hermetic Seal. 2014.