Yang, Y., Huang, Y., Liu, H., Chen, Z., Balaraju, J. N., & Engineering, S. o. M. S. &. (2014). Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability.

Yang, Ying, Yizhong Huang, Hai Liu, Zhong Chen, J. N. Balaraju, و School of Materials Science & Engineering. Interface Reaction between an Electroless Ni–Co–P Metallization and Sn–3.5Ag Lead-free Solder With Improved Joint Reliability. 2014.

Yang, Ying, et al. Interface Reaction between an Electroless Ni–Co–P Metallization and Sn–3.5Ag Lead-free Solder With Improved Joint Reliability. 2014.