Kor, K. H. B., Liu, Q., Gan, C. L., & (IPFA), I. I. S. o. t. P. a. F. A. o. I. C. (2020). Sample preparation for deprocessing of 3D multi-die stacked package.
استشهاد بنمط شيكاغوKor, Katherine Hwee Boon, Q. Liu, Chee Lip Gan, و IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). Sample Preparation for Deprocessing of 3D Multi-die Stacked Package. 2020.
MLA استشهادKor, Katherine Hwee Boon, Q. Liu, Chee Lip Gan, و IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). Sample Preparation for Deprocessing of 3D Multi-die Stacked Package. 2020.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.