Analysis of Bi-material interfacial crack with hole inclusion using boundary element method

A circular hole inclusion between the two materials is analysed, as is the association between a nearby interfacial crack between two dissimilar isotropic elastic half plates. Only tensile load acting on the matrix and perpendicular to the crack axis is taken into account. For a number of elastic co...

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主要作者: Goh, James Yan Cheng
其他作者: Ang Hock Eng
格式: Final Year Project
語言:English
出版: Nanyang Technological University 2021
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在線閱讀:https://hdl.handle.net/10356/150449
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機構: Nanyang Technological University
語言: English
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spelling sg-ntu-dr.10356-1504492021-05-28T03:04:00Z Analysis of Bi-material interfacial crack with hole inclusion using boundary element method Goh, James Yan Cheng Ang Hock Eng School of Mechanical and Aerospace Engineering MHEANG@ntu.edu.sg Engineering::Mechanical engineering A circular hole inclusion between the two materials is analysed, as is the association between a nearby interfacial crack between two dissimilar isotropic elastic half plates. Only tensile load acting on the matrix and perpendicular to the crack axis is taken into account. For a number of elastic combinations of the two step model, stress intensity factors are identified. The current method uses Quadratic quarter-point crack-tip element otherwise known as Quarter Node Shift (QNS) and is based upon its multi-region boundary element method (BEM). Depending on the relevant position of the hole inclusion, the crack length, and the relative elastic properties of the matrices, the interaction may have substantial shielding or strengthening effects on the stress intensity factor of the crack-tip. Bachelor of Engineering (Mechanical Engineering) 2021-05-28T03:04:00Z 2021-05-28T03:04:00Z 2021 Final Year Project (FYP) Goh, J. Y. C. (2021). Analysis of Bi-material interfacial crack with hole inclusion using boundary element method. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/150449 https://hdl.handle.net/10356/150449 en application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
spellingShingle Engineering::Mechanical engineering
Goh, James Yan Cheng
Analysis of Bi-material interfacial crack with hole inclusion using boundary element method
description A circular hole inclusion between the two materials is analysed, as is the association between a nearby interfacial crack between two dissimilar isotropic elastic half plates. Only tensile load acting on the matrix and perpendicular to the crack axis is taken into account. For a number of elastic combinations of the two step model, stress intensity factors are identified. The current method uses Quadratic quarter-point crack-tip element otherwise known as Quarter Node Shift (QNS) and is based upon its multi-region boundary element method (BEM). Depending on the relevant position of the hole inclusion, the crack length, and the relative elastic properties of the matrices, the interaction may have substantial shielding or strengthening effects on the stress intensity factor of the crack-tip.
author2 Ang Hock Eng
author_facet Ang Hock Eng
Goh, James Yan Cheng
format Final Year Project
author Goh, James Yan Cheng
author_sort Goh, James Yan Cheng
title Analysis of Bi-material interfacial crack with hole inclusion using boundary element method
title_short Analysis of Bi-material interfacial crack with hole inclusion using boundary element method
title_full Analysis of Bi-material interfacial crack with hole inclusion using boundary element method
title_fullStr Analysis of Bi-material interfacial crack with hole inclusion using boundary element method
title_full_unstemmed Analysis of Bi-material interfacial crack with hole inclusion using boundary element method
title_sort analysis of bi-material interfacial crack with hole inclusion using boundary element method
publisher Nanyang Technological University
publishDate 2021
url https://hdl.handle.net/10356/150449
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