Foo, T. Z. Y., & Zhong, C. (2022). Fabrication and evaluation of Ni/WSn solder joints for die-attach technology. Nanyang Technological University.
استشهاد بنمط شيكاغوFoo, Terry Zhi Yuan, و Chen Zhong. Fabrication and Evaluation of Ni/WSn Solder Joints for Die-attach Technology. Nanyang Technological University, 2022.
MLA استشهادFoo, Terry Zhi Yuan, و Chen Zhong. Fabrication and Evaluation of Ni/WSn Solder Joints for Die-attach Technology. Nanyang Technological University, 2022.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.