Wang, H., Gao, G., Wei, W., Yang, Z., Yin, G., Xie, W., . . . Engineering, S. o. E. a. E. (2023). Influence of the interface temperature on the damage morphology and material transfer of C–Cu sliding contact under different current amplitudes.
Chicago Style CitationWang, Hong, et al. Influence of the Interface Temperature On the Damage Morphology and Material Transfer of C–Cu Sliding Contact Under Different Current Amplitudes. 2023.
MLA CitationWang, Hong, et al. Influence of the Interface Temperature On the Damage Morphology and Material Transfer of C–Cu Sliding Contact Under Different Current Amplitudes. 2023.
Warning: These citations may not always be 100% accurate.