Wang, H., Gao, G., Wei, W., Yang, Z., Yin, G., Xie, W., . . . Engineering, S. o. E. a. E. (2023). Influence of the interface temperature on the damage morphology and material transfer of C–Cu sliding contact under different current amplitudes.
Chicago Style CitationWang, Hong, et al. Influence of the Interface Temperature On the Damage Morphology and Material Transfer of C–Cu Sliding Contact Under Different Current Amplitudes. 2023.
MLA引文Wang, Hong, et al. Influence of the Interface Temperature On the Damage Morphology and Material Transfer of C–Cu Sliding Contact Under Different Current Amplitudes. 2023.
警告：這些引文格式不一定是100％准確.