發送短信 : Dynamic damage analysis of thin film stacked structures for microelectronic devices

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|  __ \\   /_   _// |  __ \\    / _ \\   |__  //  
| |  \ ||   -| ||-  | |  \ ||  / //\ \\    / //   
| |__/ ||   _| ||_  | |__/ || |  ___  ||  / //__  
|_____//   /_____// |_____//  |_||  |_|| /_____|| 
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