Text this: Decapsulation of IC packages with silver wire bonds for failure analysis

  ____      _____     ____      ______    _____   
 |  _ \\   |  ___||  |  _ \\   /_   _//  / ____|| 
 | |_| ||  | ||__    | |_| ||   -| ||-  / //---`' 
 | .  //   | ||__    | .  //    _| ||_  \ \\___   
 |_|\_\\   |_____||  |_|\_\\   /_____//  \_____|| 
 `-` --`   `-----`   `-` --`   `-----`    `----`