APA引文

Dai, H., Dimitriadou, S., Krishnan, P. S. S. R., Handoko, A. D., Recatala-Gomez, J., Wang, Y., . . . Engineering, S. o. M. S. a. (2023). Sub-10 nm mixing and alloying of Cu-Ag and Cu-Ni via accelerated solid diffusion.

Chicago Style Citation

Dai, Haiwen, et al. Sub-10 Nm Mixing and Alloying of Cu-Ag and Cu-Ni Via Accelerated Solid Diffusion. 2023.

MLA引文

Dai, Haiwen, et al. Sub-10 Nm Mixing and Alloying of Cu-Ag and Cu-Ni Via Accelerated Solid Diffusion. 2023.