APA引文

Ong, K. Y., & Zhong, C. (2010). Characterization of solder/UBM interface and materials properties.

Chicago Style Citation

Ong, Kai Yie., and Chen Zhong. Characterization of Solder/UBM Interface and Materials Properties. 2010.

MLA引文

Ong, Kai Yie., and Chen Zhong. Characterization of Solder/UBM Interface and Materials Properties. 2010.

警告：這些引文格式不一定是100％准確.