Force monitoring tool to monitor mold cleanliness in a transfer molding machine

Mold cavity cleanliness has always been a major productivity issue in any type of molding processes because it affects the functionality, surface finish and/or quality of the end product, especially for transfer molding of electronic packages where too much ejection force due to sticky molds will da...

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書目詳細資料
主要作者: Ho, John Thiam Yong.
其他作者: Yu Ching Man, Simon
格式: Final Year Project
語言:English
出版: 2010
主題:
在線閱讀:http://hdl.handle.net/10356/39653
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