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 __   _      ___     __   __    ______    _____   
| || | ||   / _ \\   \ \\/ //  /_   _//  /  ___|| 
| '--' ||  / //\ \\   \   //    -| ||-  | // __   
| .--. || |  ___  ||  / . \\    _| ||_  | \\_\ || 
|_|| |_|| |_||  |_|| /_//\_\\  /_____//  \____//  
`-`  `-`  `-`   `-`  `-`  --`  `-----`    `---`

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發送短信 : Micro-deformation characterization of electronic packaging materials and assemblies