APA Citation

Deng, S., & Tan, C. M. (2008). Investigation of low temperature wafer bonding using intermediate layer.

Chicago Style Citation

Deng, Shusheng, and Cher Ming Tan. Investigation of Low Temperature Wafer Bonding Using Intermediate Layer. 2008.

MLA Citation

Deng, Shusheng, and Cher Ming Tan. Investigation of Low Temperature Wafer Bonding Using Intermediate Layer. 2008.

Warning: These citations may not always be 100% accurate.