APA引文

Deng, S., & Tan, C. M. (2008). Investigation of low temperature wafer bonding using intermediate layer.

Chicago Style Citation

Deng, Shusheng, and Cher Ming Tan. Investigation of Low Temperature Wafer Bonding Using Intermediate Layer. 2008.

MLA引文

Deng, Shusheng, and Cher Ming Tan. Investigation of Low Temperature Wafer Bonding Using Intermediate Layer. 2008.

警告：這些引文格式不一定是100％准確.