APA引文

Tan, Y. C., & Ming, T. C. (2011). Electromigration study of through silicon via (TSV).

Chicago Style Citation

Tan, Yeow Chong, and Tan Cher Ming. Electromigration Study of Through Silicon Via (TSV). 2011.

MLA引文

Tan, Yeow Chong, and Tan Cher Ming. Electromigration Study of Through Silicon Via (TSV). 2011.

警告：這些引文格式不一定是100％准確.