APA Citation

Tan, Y. C., & Ming, T. C. (2011). Electromigration study of through silicon via (TSV).

Chicago Style Citation

Tan, Yeow Chong, and Tan Cher Ming. Electromigration Study of Through Silicon Via (TSV). 2011.

MLA Citation

Tan, Yeow Chong, and Tan Cher Ming. Electromigration Study of Through Silicon Via (TSV). 2011.

Warning: These citations may not always be 100% accurate.