APA Citation

Sia, K. M., & Beng, T. S. (2011). Grinding of silicon wafer for molding applications.

Chicago Style Citation

Sia, Kai Ming., and Tor Shu Beng. Grinding of Silicon Wafer for Molding Applications. 2011.

MLA Citation

Sia, Kai Ming., and Tor Shu Beng. Grinding of Silicon Wafer for Molding Applications. 2011.

Warning: These citations may not always be 100% accurate.