APA引文

Sia, K. M., & Beng, T. S. (2011). Grinding of silicon wafer for molding applications.

Chicago Style Citation

Sia, Kai Ming., and Tor Shu Beng. Grinding of Silicon Wafer for Molding Applications. 2011.

MLA引文

Sia, Kai Ming., and Tor Shu Beng. Grinding of Silicon Wafer for Molding Applications. 2011.

警告：這些引文格式不一定是100％准確.