Onkaraiah., S., & Seng, T. C. (2011). Electrical modeling of through-silicon-via for 3D integrated circuits.
استشهاد بنمط شيكاغوOnkaraiah., Santhosh, و Tan Chuan Seng. Electrical Modeling of Through-silicon-via for 3D Integrated Circuits. 2011.
MLA استشهادOnkaraiah., Santhosh, و Tan Chuan Seng. Electrical Modeling of Through-silicon-via for 3D Integrated Circuits. 2011.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.