發送短信 : Electrical design, modelling and optimization of a low-cost wafer level chip scale package (WL-CSP)

  ____     __   __    ______    _____      _____  
 |  _ \\   \ \\/ //  /_   _//  |  ___||   / ___// 
 | |_| ||   \ ` //   `-| |,-   | ||__     \___ \\ 
 | .  //     | ||      | ||    | ||__     /    // 
 |_|\_\\     |_||      |_||    |_____||  /____//  
 `-` --`     `-`'      `-`'    `-----`  `-----`