Kim, J. H., & Engineering, S. o. M. S. &. (2008). Copper diffusion barriers for multilevel interconnecting metalization scheme in microelectronics appplication.
Chicago Style CitationKim, Jae Hyung., and School of Materials Science & Engineering. Copper Diffusion Barriers for Multilevel Interconnecting Metalization Scheme in Microelectronics Appplication. 2008.
MLA引文Kim, Jae Hyung., and School of Materials Science & Engineering. Copper Diffusion Barriers for Multilevel Interconnecting Metalization Scheme in Microelectronics Appplication. 2008.
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