Kim, J. H., & Engineering, S. o. M. S. &. (2008). Copper diffusion barriers for multilevel interconnecting metalization scheme in microelectronics appplication.
استشهاد بنمط شيكاغوKim, Jae Hyung., و School of Materials Science & Engineering. Copper Diffusion Barriers for Multilevel Interconnecting Metalization Scheme in Microelectronics Appplication. 2008.
MLA استشهادKim, Jae Hyung., و School of Materials Science & Engineering. Copper Diffusion Barriers for Multilevel Interconnecting Metalization Scheme in Microelectronics Appplication. 2008.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.