APA Citation

Kim, J. H., & Engineering, S. o. M. S. &. (2008). Copper diffusion barriers for multilevel interconnecting metalization scheme in microelectronics appplication.

Chicago Style Citation

Kim, Jae Hyung., and School of Materials Science & Engineering. Copper Diffusion Barriers for Multilevel Interconnecting Metalization Scheme in Microelectronics Appplication. 2008.

MLA Citation

Kim, Jae Hyung., and School of Materials Science & Engineering. Copper Diffusion Barriers for Multilevel Interconnecting Metalization Scheme in Microelectronics Appplication. 2008.

Warning: These citations may not always be 100% accurate.