發送短信 : Characterization and structural modification of polysilsesquioxanes for low dielectric constant (k) applications in deep sub-micron devices

__    __    ______              _____    _    _   
\ \\ / //  /_   _//   ____     |  ___|| | |  | || 
 \ \/ //    -| ||-   |    \\   | ||__   | |/\| || 
  \  //     _| ||_   | [] ||   | ||__   |  /\  || 
   \//     /_____//  |  __//   |_____|| |_// \_|| 
    `      `-----`   |_|`-`    `-----`  `-`   `-` 
                     `-`