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  _____     ______    ______   __   __    _____   
 |__  //   /_   _//  /_____//  \ \\/ //  / ____|| 
   / //     -| ||-   `____ `    \ ` //  / //---`' 
  / //__    _| ||_   /___//      | ||   \ \\___   
 /_____||  /_____//  `__ `       |_||    \_____|| 
 `-----`   `-----`   /_//        `-`'     `----`  
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Text this: Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages