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  _  _      ___      ______    ______   _    _   
 | \| ||   / _ \\   /_____//  /_   _// | \  / || 
 |  ' ||  / //\ \\  `____ `    -| ||-  |  \/  || 
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 |_|\_|| |_||  |_|| `__ `     /_____// |_|\/|_|| 
 `-` -`  `-`   `-`  /_//      `-----`  `-`  `-`  
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Text this: Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages