Yeo, A. S. H., & Pang, J. H. L. (2008). Development of a failure assessment methodology for flip chip electronic assembly.
استشهاد بنمط شيكاغوYeo, Alfred Swain Hong., و John Hock Lye Pang. Development of a Failure Assessment Methodology for Flip Chip Electronic Assembly. 2008.
MLA استشهادYeo, Alfred Swain Hong., و John Hock Lye Pang. Development of a Failure Assessment Methodology for Flip Chip Electronic Assembly. 2008.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.