Yeo, A. S. H., & Pang, J. H. L. (2008). Development of a failure assessment methodology for flip chip electronic assembly.
Chicago Style CitationYeo, Alfred Swain Hong., and John Hock Lye Pang. Development of a Failure Assessment Methodology for Flip Chip Electronic Assembly. 2008.
MLA CitationYeo, Alfred Swain Hong., and John Hock Lye Pang. Development of a Failure Assessment Methodology for Flip Chip Electronic Assembly. 2008.
Warning: These citations may not always be 100% accurate.