APA引文

Yeo, A. S. H., & Pang, J. H. L. (2008). Development of a failure assessment methodology for flip chip electronic assembly.

Chicago Style Citation

Yeo, Alfred Swain Hong., and John Hock Lye Pang. Development of a Failure Assessment Methodology for Flip Chip Electronic Assembly. 2008.

MLA引文

Yeo, Alfred Swain Hong., and John Hock Lye Pang. Development of a Failure Assessment Methodology for Flip Chip Electronic Assembly. 2008.

警告：這些引文格式不一定是100％准確.