發送短信 : Development of a failure assessment methodology for flip chip electronic assembly

 _    _      ___      ______    _____     _  __  
| \  / ||   / _ \\   /_   _//  |  ___||  | |/ // 
|  \/  ||  / //\ \\    | ||    | ||__    | ' //  
| .  . || |  ___  ||  _| ||    | ||__    | . \\  
|_|\/|_|| |_||  |_|| /__//     |_____||  |_|\_\\ 
`-`  `-`  `-`   `-`  `--`      `-----`   `-` --`