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            _____     _  _      ___      ______  
  ____     |  ___||  | \| ||   / _ \\   /_   _// 
 |    \\   | ||__    |  ' ||  / //\ \\    | ||   
 | [] ||   | ||__    | .  || |  ___  ||  _| ||   
 |  __//   |_____||  |_|\_|| |_||  |_|| /__//    
 |_|`-`    `-----`   `-` -`  `-`   `-`  `--`     
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發送短信 : Optimization of wire bond process for yield improvement with ball grid array