發送短信 : Optimization of wire bond process for yield improvement with ball grid array

  ______    _____    __   _      ___       _____  
 /_   _//  |  ___|| | || | ||   / _ \\    / ___// 
 `-| |,-   | ||__   | '--' ||  | / \ ||   \___ \\ 
   | ||    | ||__   | .--. ||  | \_/ ||   /    // 
   |_||    |_____|| |_|| |_||   \___//   /____//  
   `-`'    `-----`  `-`  `-`    `---`   `-----`