Bhowmik, H., & Ping, T. C. (2008). Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel.
استشهاد بنمط شيكاغوBhowmik, Himangshu, و Tso Chih Ping. Analyses of Steady and Unsteady Thermal Behaviour of Simulated Electronic Chips in a Liquid Cooled Vertical Rectangular Channel. 2008.
MLA استشهادBhowmik, Himangshu, و Tso Chih Ping. Analyses of Steady and Unsteady Thermal Behaviour of Simulated Electronic Chips in a Liquid Cooled Vertical Rectangular Channel. 2008.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.