Glass frit hermetic encapsulation for harsh environment multi-chip module application
This research project aims to investigate the suitability of glass frit bonding for multi-chip module (MCM) package encapsulation that needs to operate at a high temperature of 300°C and high pressure of 207 MPa. Since glass has the potential to bond well to alumina due to the chemical compatibility...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2014
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| Online Access: | https://hdl.handle.net/10356/59379 |
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| Institution: | Nanyang Technological University |
| Language: | English |
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