APA引文

Lim, S. H., & Chian, K. S. (2008). Effect of moisture on the curing and processing behaviour of an epoxy underfill system.

Chicago Style Citation

Lim, Sin Heng., and Kerm Sin Chian. Effect of Moisture On the Curing and Processing Behaviour of an Epoxy Underfill System. 2008.

MLA引文

Lim, Sin Heng., and Kerm Sin Chian. Effect of Moisture On the Curing and Processing Behaviour of an Epoxy Underfill System. 2008.

警告:這些引文格式不一定是100%准確.