APA引文

Hussain, N. A., & Beng, T. S. (2014). Thermal bonding of thermoplastic microfluidic devices.

Chicago Style Citation

Hussain, Nor Aza, and Tor Shu Beng. Thermal Bonding of Thermoplastic Microfluidic Devices. 2014.

MLA引文

Hussain, Nor Aza, and Tor Shu Beng. Thermal Bonding of Thermoplastic Microfluidic Devices. 2014.

警告：這些引文格式不一定是100％准確.