Micro-mechanics of interfacial debonding: demolding of hot-embossed polymeric microfluidic substrate
Hot-embossing is one well-known micro-molding technique to fabricate the highly potential polymeric microfuidic devices. During the process, demolding which involves separation of polymer substrate from the mold is one crucial factor in determining the success of replication, because demolding defec...
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| 格式: | Theses and Dissertations |
| 語言: | English |
| 出版: |
2015
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| 在線閱讀: | https://hdl.handle.net/10356/64824 |
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| 機構: | Nanyang Technological University |
| 語言: | English |