APA引文

Tee, T. Y., & Zhaowei, Z. (2008). Package and board level reliability modeling of advanced CSP pakages for telecommunication applications.

Chicago Style Citation

Tee, Tong Yan, and Zhong Zhaowei. Package and Board Level Reliability Modeling of Advanced CSP Pakages for Telecommunication Applications. 2008.

MLA引文

Tee, Tong Yan, and Zhong Zhaowei. Package and Board Level Reliability Modeling of Advanced CSP Pakages for Telecommunication Applications. 2008.

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