Tee, T. Y., & Zhaowei, Z. (2008). Package and board level reliability modeling of advanced CSP pakages for telecommunication applications.
استشهاد بنمط شيكاغوTee, Tong Yan, و Zhong Zhaowei. Package and Board Level Reliability Modeling of Advanced CSP Pakages for Telecommunication Applications. 2008.
MLA استشهادTee, Tong Yan, و Zhong Zhaowei. Package and Board Level Reliability Modeling of Advanced CSP Pakages for Telecommunication Applications. 2008.
تحذير: قد لا تكون هذه الاستشهادات دائما دقيقة بنسبة 100%.