APA Citation

Tee, T. Y., & Zhaowei, Z. (2008). Package and board level reliability modeling of advanced CSP pakages for telecommunication applications.

Chicago Style Citation

Tee, Tong Yan, and Zhong Zhaowei. Package and Board Level Reliability Modeling of Advanced CSP Pakages for Telecommunication Applications. 2008.

MLA Citation

Tee, Tong Yan, and Zhong Zhaowei. Package and Board Level Reliability Modeling of Advanced CSP Pakages for Telecommunication Applications. 2008.

Warning: These citations may not always be 100% accurate.