APA Citation

Zhang, K., & Yizhong, H. (2016). Solid state interfacial reaction of Sn-3.5Ag solders with Ni-P and Ni-W-P under bump metallization.

Chicago Style Citation

Zhang, Keran, and Huang Yizhong. Solid State Interfacial Reaction of Sn-3.5Ag Solders With Ni-P and Ni-W-P Under Bump Metallization. 2016.

MLA Citation

Zhang, Keran, and Huang Yizhong. Solid State Interfacial Reaction of Sn-3.5Ag Solders With Ni-P and Ni-W-P Under Bump Metallization. 2016.

Warning: These citations may not always be 100% accurate.